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Visiting Wang Meihong(username: chenluseo)
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As component miniaturization and chip integration continue to rise, the use of a vacuum reflow oven is essential in modern electronics manufacturing. There has been a significant increase in the prevalence of array packages like BGA and CSP in a variety of electronics products, including laptops, smartphones, medical devices, automotive electronics, and aerospace products. Because of the miniaturization and complexity of today's products, there is a growing demand for higher quality products.
Surface mount soldering with voids poses a significant risk to product reliability after SMT surface mount soldering. In addition to solder paste, PCB pad surface treatment, reflow profile settings, environmental conditions, and design considerations, several other factors contribute to void formation. A primary cause, however, is residual gas from molten solder during the soldering process. Nitrogen Reflow Soldering is often employed to deal with this problem.
As a rule of thumb, voids in solder joints should not exceed 5% of the total area of PCBs for power electronics technology. With conventional processes, it is difficult to achieve such void control, so advanced technologies such as vacuum reflow soldering must be used. As a result of this technology, conducted in a vacuum environment, little or no gas is entrapped in solder joints, thereby ensuring minimal or no voids are created. The use of a Vacuum Reflow Oven becomes crucial, especially in large-area soldering applications, because it significantly improves the thermal and electrical conductivity of solder joints. As gas bubbles escape from the vacuum environment, high-quality, void-free solder joints are produced, ensuring electronic components' reliability and performance.
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